Title:
POLYAMIDE FILM LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/068121
Kind Code:
A1
Abstract:
The present invention provides a polyamide film laminate which has more sufficiently excellent heat resistance, flexibility, adhesion between a metal layer and a polyamide film, and transmission characteristics, and in which warpage is more sufficiently reduced even after a heat treatment (e.g., reflow treatment). The present invention pertains to a polyamide film laminate comprising a metal layer on a polyamide film (F) that contains a polyamide (E) including a unit derived from an aliphatic dicarboxylic acid (A) having 18 or more carbon atoms, a unit derived from an aliphatic diamine (B) having 18 or more carbon atoms, a unit derived from an aromatic dicarboxylic acid (C) having 12 or less carbon atoms, and a unit derived from an aliphatic diamine (D) having 12 or less carbon atoms, and that has a melting point of 240°C or higher, a crystal melting enthalpy of 15 J/g or greater, an elongation recovery ratio of 30% or greater in a hysteresis test, and a tensile modulus of 2500 MPa or lower.
Inventors:
TAKAISHI NAOKI (JP)
MARUO TAKESHI (JP)
HATTORI YOSHIO (JP)
MARUO TAKESHI (JP)
HATTORI YOSHIO (JP)
Application Number:
PCT/JP2022/037978
Publication Date:
April 27, 2023
Filing Date:
October 12, 2022
Export Citation:
Assignee:
UNITIKA LTD (JP)
International Classes:
B32B27/34; B32B7/022; B32B15/088; C08G69/02; C08G69/26; H01Q1/38; H05K1/03
Domestic Patent References:
| WO2021106541A1 | 2021-06-03 | |||
| WO2020085360A1 | 2020-04-30 | |||
| WO2022054944A1 | 2022-03-17 |
Foreign References:
| JP2020514139A | 2020-05-21 | |||
| JP2012234849A | 2012-11-29 | |||
| JP2021154650A | 2021-10-07 | |||
| JPS6274641A | 1987-04-06 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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