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Title:
POLYAMIDE-IMIDE RESIN COMPOSITION AND PRODUCTION METHOD FOR POLYAMIDE-IMIDE RESIN
Document Type and Number:
WIPO Patent Application WO/2020/230330
Kind Code:
A1
Abstract:
A polyamide-imide resin composition that includes a polyamide-imide resin and a solvent that contains a compound that is represented by formula (1). (In the formula, R1 is a C1–8 alkyl group, R2 and R3 are each independently a hydrogen atom or a C1–8 alkyl group, and X is a C1–8 alkylene group.)

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Inventors:
SAITO YASUYUKI (JP)
TAKAHASHI ATSUSHI (JP)
SATAKE REI (JP)
Application Number:
PCT/JP2019/019560
Publication Date:
November 19, 2020
Filing Date:
May 16, 2019
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08L79/08; C08G73/14; C08K5/20; C08L63/00; C09D7/63; C09D179/08
Domestic Patent References:
WO2018150566A12018-08-23
WO2018002988A12018-01-04
WO2017217293A12017-12-21
Foreign References:
JP2017223838A2017-12-21
JP2017517582A2017-06-29
JP2018146795A2018-09-20
JP2012077249A2012-04-19
JPH0439323A1992-02-10
Other References:
See also references of EP 3971243A4
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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