Title:
POLY(AMIDE-IMIDE) RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/185718
Kind Code:
A1
Abstract:
A poly(amide-imide) resin comprising a structural unit (Ia) represented by the following formula and at least one structural unit selected from the group consisting of structural units (IIa), (IIb), and (IIc) represented by the following formulae. In the structural unit (Ia), the X moieties each independently represent a hydrogen atom or a substituent selected from the group consisting of halogen atoms, C1-C9 alkyl groups, C1-C9 alkoxy groups, and hydroxyalkyl groups. In the structural units (IIa), (IIb), and (IIc), the S moieties each independently represent a C1-C3 alkyl group, a is an integer of 0-4, b is an integer of 0-3, and c is an integer of 0-4.
Inventors:
HASHIMOTO GAKU (JP)
NIWA TAKAAKI (JP)
SATO EIICHI (JP)
SATO MIZUKI (JP)
NIWA TAKAAKI (JP)
SATO EIICHI (JP)
SATO MIZUKI (JP)
Application Number:
PCT/JP2022/000703
Publication Date:
September 09, 2022
Filing Date:
January 12, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08G73/10; C08L79/08; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
| WO2021045004A1 | 2021-03-11 |
Foreign References:
| JP2008074991A | 2008-04-03 | |||
| JP2005146118A | 2005-06-09 | |||
| JP2000143802A | 2000-05-26 | |||
| JP2007077308A | 2007-03-29 | |||
| JP2013135061A | 2013-07-08 | |||
| JP2021034526A | 2021-03-01 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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