POLYAMIDE RESIN COMPOSITION, AND LIGHTWEIGHT HIGH-STRENGTH MOLDED PRODUCT MANUFACTURED THEREFROM

Title:

POLYAMIDE RESIN COMPOSITION, AND LIGHTWEIGHT HIGH-STRENGTH MOLDED PRODUCT MANUFACTURED THEREFROM

Document Type and Number:

WIPO Patent Application WO/2024/058580

Kind Code:

A1

Abstract:

The present invention relates to a polyamide resin composition, and a lightweight high-strength molded product manufactured therefrom. The polyamide resin composition according to the present invention comprises a polyamide-based resin, hollow glass, an inorganic filler and a hyperbranched polymer, and thus can prevent damage to hollow glass and improve mechanical properties while having a greatly reduced weight in contrast to a raw material.

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Inventors:

HONG SANGHYUN (KR)
SHIM SANG-EUN (KR)
HWANG SO-SAN (KR)
LEE JAE-WON (KR)

Application Number:

PCT/KR2023/013852

Publication Date:

March 21, 2024

Filing Date:

September 14, 2023

Export Citation:

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Assignee:

LG ELECTRONICS INC (KR)
UNIV INHA RES & BUSINESS FOUND (KR)

International Classes:

C08L77/00; C08K3/013; C08K7/28; C08L101/00

Foreign References:

CN110437612A	2019-11-12
KR20200072225A	2020-06-22
JP2007119669A	2007-05-17
KR20190075248A	2019-07-01
CN111253727A	2020-06-09

Attorney, Agent or Firm:

DAE-A INTELLECTUAL PROPERTY CONSULTING (KR)

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