Title:
POLYAMIDE RESIN COMPOSITION, MAGNETIC MATERIAL RESIN COMPOSITE MATERIAL AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/181711
Kind Code:
A1
Abstract:
The present invention provides a polyamide resin composition which contains, in 100% y mass of the polyamide resin composition, 10% by mass to 50% by mass of a polyamide elastomer (A), 40% by mass to 75% by mass of an aliphatic homopolyamide resin (B) that has an average of more than 6 carbon atoms relative to one amide group, and 0.5% by mass to 30% by mass of an aliphatic copolymerized polyamide resin (C), while substantially containing no aromatic polyamide resins. The present invention also provides a magnetic material resin composite material which contains a polyamide resin composition (X) and a magnetic powder (Y), wherein: 5.0% by mass to 30.0% by mass of the polyamide resin composition (X) and 70.0% by mass to 95.0% by mass of the magnetic powder (Y) are contained in a total of 100% by mass of the polyamide resin composition (X) and the magnetic powder (Y); and 10% by mass to 50% by mass of a polyamide elastomer (A), 40% by mass to 75% by mass of an aliphatic homopolyamide resin (B) that has an average of more than 6 carbon atoms relative to one amide group, 0.5% by mass to 30% by mass of an aliphatic copolymerized polyamide resin (C), and no aromatic polyamide resins are contained in 100% by mass of the polyamide resin composition (X).
Inventors:
KURACHI KOICHIRO (JP)
IRISA YUMA (JP)
IRISA YUMA (JP)
Application Number:
PCT/JP2023/004979
Publication Date:
September 28, 2023
Filing Date:
February 14, 2023
Export Citation:
Assignee:
UBE CORP (JP)
International Classes:
C08L77/00; C08K3/01
Domestic Patent References:
WO2008123450A1 | 2008-10-16 | |||
WO2022075180A1 | 2022-04-14 |
Foreign References:
JP2010222394A | 2010-10-07 | |||
JP2020200555A | 2020-12-17 | |||
JP2021113274A | 2021-08-05 | |||
JPH115898A | 1999-01-12 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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