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Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OBTAINED BY MOLDING SAME
Document Type and Number:
WIPO Patent Application WO/2021/006257
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a polyamide resin composition having excellent fluidity and capable of obtaining a molded article having excellent pry strength and metal adhesiveness. In essence, the present invention is a polyamide resin composition containing 0.1-10 mass parts inclusive of an ammonium salt (B) ccomprising a C6-12 aliphatic dicarboxylic acid and ammonia per 100 mass parts of a polyamide resin (A).

Inventors:
MORIOKA NOBUHIRO (JP)
TAMAI AKIYOSHI (JP)
UMETSU HIDEYUKI (JP)
Application Number:
PCT/JP2020/026507
Publication Date:
January 14, 2021
Filing Date:
July 07, 2020
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08K5/09; C08K5/49; C08L77/00
Domestic Patent References:
WO2011145498A12011-11-24
Foreign References:
JP2001200156A2001-07-24
JP2005105192A2005-04-21
JPS4993642A1974-09-05
JPS49509A1974-01-07
JP2015010210A2015-01-19
Other References:
See also references of EP 3998305A4
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