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Title:
POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE OBTAINED BY MOLDING SAME
Document Type and Number:
WIPO Patent Application WO/2022/196505
Kind Code:
A1
Abstract:
The present invention pertains to a polyamide resin composition which contains, with respect to 100 parts by mass of a polyamide resin (A), 0.1-100 parts by mass of a thermoplastic resin (B) having a reactive functional group and 0.1-5 parts by mass of an organically modified siloxane compound (C) having a specific structure.

Inventors:
NISHIDA SHINGO (JP)
AKITA MASARU (JP)
Application Number:
PCT/JP2022/010429
Publication Date:
September 22, 2022
Filing Date:
March 09, 2022
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L77/00; C08K5/435; C08L83/06; C08L83/10; C08L101/06
Foreign References:
JP2005082693A2005-03-31
JP2018009139A2018-01-18
JP2020204024A2020-12-24
JPH084746A1996-01-09
CN103160111A2013-06-19
JP2015530454A2015-10-15
JP2012107244A2012-06-07
JP2020059846A2020-04-16
JP2017095542A2017-06-01
JP2002201351A2002-07-19
JP2011195790A2011-10-06
US3306874A1967-02-28
JP2021042120A2021-03-18
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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