Title:
POLYAMIDE RESIN COMPOSITION AND POLYAMIDE MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/136207
Kind Code:
A1
Abstract:
A polyamide resin composition comprising a polyamide resin and glass fibers containing a surface treatment agent or a convergence agent. The surface treatment agent or convergence agent contains an acidic group. The polyamide resin contains a dicarboxylic acid-derived component unit (a) and a diamine-derived component unit (b), wherein: the dicarboxylic acid-derived component unit (a) contains a component unit derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid; and the diamine-derived component unit (b) contains a component unit (b2) derived from a diamine represented by formula (1) in an amount of 10 mol% or more and less than 50 mol% relative to the total mole number of the diamine-derived component unit (b).
Inventors:
UEDA KOSUKE
MAKIGUCHI WATARU
DOI HARUKA
NISHINO KOHEI
WASHIO ISAO
KONDO TAKAHIRO
MAKIGUCHI WATARU
DOI HARUKA
NISHINO KOHEI
WASHIO ISAO
KONDO TAKAHIRO
Application Number:
PCT/JP2023/000145
Publication Date:
July 20, 2023
Filing Date:
January 06, 2023
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08L77/06; C08G69/26; C08K7/14
Domestic Patent References:
WO2020040282A1 | 2020-02-27 | |||
WO2022014390A1 | 2022-01-20 | |||
WO2022210019A1 | 2022-10-06 | |||
WO2022196715A1 | 2022-09-22 |
Foreign References:
JPS63154739A | 1988-06-28 | |||
JPS53125497A | 1978-11-01 | |||
JPH04366168A | 1992-12-18 |
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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