POLYAMIDE RESIN COMPOSITION FOR MOLDED PRODUCT COMING INTO CONTACT WITH HIGH-PRESSURE HYDROGEN AND MOLDED PRODUCT USING SAME

Title:

POLYAMIDE RESIN COMPOSITION FOR MOLDED PRODUCT COMING INTO CONTACT WITH HIGH-PRESSURE HYDROGEN AND MOLDED PRODUCT USING SAME

Document Type and Number:

WIPO Patent Application WO/2016/080151

Kind Code:

A1

Abstract:

Provided is a polyamide resin composition that is used for molded products coming into contact with high-pressure hydrogen and that is obtained by blending: a polyamide resin (A) including a unit derived from hexamethylendiamine and a unit derived from a C8-C12 aliphatic dicarboxylic acid; and an ethylene/α-olefin copolymer (B) that has been modified with an unsaturated carboxylic acid and/or a derivative thereof. Provided is a polyamide resin composition that can provide a molded product that has excellent flexibility and heat cycle resistance and in which the generation of defective spots is suppressed even after repeated filling with the high-pressure hydrogen and releasing the pressure.

Inventors:

OCHIAI SHINICHIRO (JP)
SATO DAISUKE (JP)
KOBAYASHI SADAYUKI (JP)

Application Number:

PCT/JP2015/080094

Publication Date:

May 26, 2016

Filing Date:

October 26, 2015

Export Citation:

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Assignee:

TORAY INDUSTRIES (JP)

International Classes:

C08L77/06; C08L23/26; C08L51/06; H01M8/04

Domestic Patent References:

WO2013136596A1	2013-09-19
WO2013114689A1	2013-08-08

Foreign References:

JP2009191871A	2009-08-27
JP2007204674A	2007-08-16

Other References: