Title:
POLYAMIDE RESIN AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2016/208272
Kind Code:
A1
Abstract:
Provided is a polyamide resin which has high transparency and excellent thermal aging resistance.
A polyamide resin which contains a constituent unit derived from a diamine and a constituent unit derived from a dicarboxylic acid, and wherein: 70% by mole or more of the constituent unit derived from a diamine is derived from 1,3-bis(aminomethyl)cyclohexane; 10-90% by mole of the constituent unit derived from a dicarboxylic acid is derived from isophthalic acid; 90-10% by mole of the constituent unit derived from a dicarboxylic acid is derived from a linear aliphatic dicarboxylic acid having 8-12 carbon atoms; and a constituent unit derived from terephthalic acid is not substantially contained.
Inventors:
TSUNAKA NOBUHIDE (JP)
KATO TOMONORI (JP)
OGURO HATSUKI (JP)
CHIBA TOMO (JP)
KOBAYASHI MASAYUKI (JP)
KATO TOMONORI (JP)
OGURO HATSUKI (JP)
CHIBA TOMO (JP)
KOBAYASHI MASAYUKI (JP)
Application Number:
PCT/JP2016/063270
Publication Date:
December 29, 2016
Filing Date:
April 27, 2016
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G69/26
Domestic Patent References:
| WO2011132456A1 | 2011-10-27 | |||
| WO2012014772A1 | 2012-02-02 |
Foreign References:
| US20140127440A1 | 2014-05-08 | |||
| US3012994A | 1961-12-12 | |||
| JP2010285553A | 2010-12-24 | |||
| JP2001115017A | 2001-04-24 |
Other References:
See also references of EP 3312215A4
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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