Title:
POLYBUTYLENE TEREPHTHALATE RESIN COMPOSITION, METAL COMPOSITE COMPONENT, AND METHOD FOR PRODUCING METAL COMPOSITE COMPONENT
Document Type and Number:
WIPO Patent Application WO/2011/155289
Kind Code:
A1
Abstract:
Disclosed are: a polybutylene terephthalate resin composition which is capable of providing a metal composite component having excellent adhesion between a metal component and the polybutylene terephthalate resin composition even in cases where the mold temperature is 100˚C or less; and a method for producing a metal composite component. Also disclosed is a metal composite component which has excellent adhesion between a metal component and a polybutylene terephthalate resin composition.
Specifically, a metal composite component is produced by blending a specific amount of a polyethylene terephthalate resin, which is modified by a dicarbonyl unit other than a terephthaolyl unit, into a polybutylene terephthalate resin.
More Like This:
Inventors:
WAKATSUKA SEI (JP)
Application Number:
PCT/JP2011/061084
Publication Date:
December 15, 2011
Filing Date:
May 13, 2011
Export Citation:
Assignee:
WINTECH POLYMER LTD (JP)
WAKATSUKA SEI (JP)
WAKATSUKA SEI (JP)
International Classes:
C08L67/02; B29C45/14; C08K3/22; C08K5/3492; C08K5/51; C08L27/12
Domestic Patent References:
WO2008047811A1 | 2008-04-24 |
Foreign References:
JP2007146118A | 2007-06-14 | |||
JP2007161840A | 2007-06-28 | |||
JP2004240292A | 2004-08-26 | |||
JP2000035509A | 2000-02-02 | |||
JP2006176691A | 2006-07-06 |
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
Right wood Masayuki (JP)
Right wood Masayuki (JP)
Download PDF:
Claims:
Previous Patent: DATA INDEX DIMENSION REDUCTION METHOD, AND DATA SEARCH METHOD AND DEVICE USING SAME
Next Patent: PACKAGING BODY
Next Patent: PACKAGING BODY