Title:
POLYCRYSTALLINE DIAMOND COMPACT HAVING CUTTING SURFACE DISTINCTION MARK
Document Type and Number:
WIPO Patent Application WO/2014/104587
Kind Code:
A1
Abstract:
The present invention relates to a cutting tool having a cutting surface distinction mark in a diamond compact, and more specifically, a polycrystalline diamond compact according to the present invention comprises: a tungsten carbide layer provided with a distinction mark on the outer circumferential surface thereof; a polycrystalline diamond layer formed on top of the tungsten carbide layer; and a toughness portion, which is provided inside the polycrystalline diamond layer and which has a higher toughness than the polycrystalline diamond layer, wherein the distinction mark indicates whether the polycrystalline diamond layer corresponding to the marked position is a surface which can be cut. According to the present invention, a cutting area can be easily identified and installed on the cutting tool even when distinguishing between the toughness portion and other portions is difficult from outward appearance, by using the polycrystalline diamond compact comprising the toughness portion during cutting work.
Inventors:
CHOI DONG IK (KR)
PARK HEE SUB (KR)
PARK HEE SUB (KR)
Application Number:
PCT/KR2013/010749
Publication Date:
July 03, 2014
Filing Date:
November 26, 2013
Export Citation:
Assignee:
ILJIN DIAMOND CO LTD (KR)
International Classes:
C04B35/52; B22F3/00; B23B27/14; C01B31/06
Foreign References:
| KR20090122312A | 2009-11-27 | |||
| US20120189393A1 | 2012-07-26 | |||
| JP2007153666A | 2007-06-21 | |||
| KR20090048128A | 2009-05-13 |
Attorney, Agent or Firm:
HAN, Chi Won (KR)
νμΉμ (KR)
νμΉμ (KR)
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