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Title:
POLYESTER-BASED RESIN COMPOSITION FOR LASER DIRECT STRUCTURING
Document Type and Number:
WIPO Patent Application WO/2017/038409
Kind Code:
A1
Abstract:
Provided is a polyester-based resin composition for laser direct structuring, which exhibits high platability and excellent mechanical properties. This polyester-based resin composition for laser direct structuring is characterized by containing a laser direct structuring additive (C) at a quantity of 1-20 parts by mass relative to a total of 100 parts by mass of a thermoplastic polyester resin (A) and a thermoplastic resin (B) having a water absorption rate of 0.15 mass% or more, as measured using the ISO 62A method.

More Like This:
JPH02197579PRETREATING AGENT FOR ELECTROLESS PLATING OF POLYAMIDE RESIN
Inventors:
YAMANAKA YASUSHI (JP)
Application Number:
PCT/JP2016/073485
Publication Date:
March 09, 2017
Filing Date:
August 09, 2016
Export Citation:
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Assignee:
MITSUBISHI ENGINEERING-PLASTICS CORP (JP)
International Classes:
C23C18/20; C08K3/22; C08L67/00; C08L69/00; C08L77/00
Foreign References:
JP2015120908A2015-07-02
JP2014240452A2014-12-25
JP2013144767A2013-07-25
JP2015071739A2015-04-16
JP2005231219A2005-09-02
JP2011195820A2011-10-06
JP2010229410A2010-10-14
JP2012229315A2012-11-22
JP2015048440A2015-03-16
Other References:
See also references of EP 3346024A4
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
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