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Patent Searching and Data


Title:
POLYESTER-BASED SHRINK FILM
Document Type and Number:
WIPO Patent Application WO/2023/188469
Kind Code:
A1
Abstract:
The present invention provides a polyester-based shrink film that has excellent high-humidity storage stability with little change in physical properties even at high-humidity and that effectively suppresses a film breakage phenomenon at the time of heat shrinking. Provided is a polyester-based shrink film derived from a polyester-based resin composition which contains a crystalline polyester resin in the range of 10-70 wt% with respect to the entire amount of resin, said polyester-based shrink film satisfying conditions (a) and (b) below. (a) E1 and E2 satisfy relational expression (1), where E1 (MPa) and E2 (MPa) are the upper yield point stresses before and after thirty days of storage at a high humidity of 50% RH and at 23°C, in a stress-strain curve for the MD orthogonal to the main shrinking direction. (1): 0≤E2-E1≤10 (b) Thermal shrinkage A1 (main shrinking direction, 98°C, 10 seconds) is in the range of 30-80%.

Inventors:
KANEKO TAKUMA (JP)
KANZAKA YUICHIRO (JP)
YUGE SHUUTA (JP)
IRIFUNE TATSUYA (JP)
Application Number:
PCT/JP2022/036186
Publication Date:
October 05, 2023
Filing Date:
September 28, 2022
Export Citation:
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Assignee:
C I TAKIRON CORP (JP)
BONSET AMERICA CORP (US)
BONSET LATIN AMERICA S A (UY)
International Classes:
C08J5/18
Foreign References:
JP2006028210A2006-02-02
JP2006045317A2006-02-16
JP2014024253A2014-02-06
JPH10204273A1998-08-04
Attorney, Agent or Firm:
EMORI Kenji et al. (JP)
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