POLYESTER RESIN CHIP FOR FOAMING, POLYESTER FOAM SHEET USING SAME, AND MANUFACTURING METHOD THEREFOR

Title:

POLYESTER RESIN CHIP FOR FOAMING, POLYESTER FOAM SHEET USING SAME, AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2021/210856

Kind Code:

A1

Abstract:

The present invention relates to a polyester resin chip for foaming, a polyester foam sheet using same, and a manufacturing method therefor, wherein a copolymer polyester resin having a melting point of 180 to 255°C is employed to lower the foaming temperature and sheet molding temperature, making the process control easy.

Inventors:

CHOI JONG HAN (KR)
LEE KWANG HEE (KR)
HUH MEE (KR)
KIM WOO JIN (KR)
HA SANG HUN (KR)

Application Number:

PCT/KR2021/004501

Publication Date:

October 21, 2021

Filing Date:

April 09, 2021

Export Citation:

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Assignee:

HUVIS CORP (KR)

International Classes:

C08J9/00; B29B7/74; B29C48/00; C08G63/183; C08K3/26; C08L67/02

Foreign References:

KR20180017874A	2018-02-21
US20130011657A1	2013-01-10
KR20020002212A	2002-01-09
KR20190037513A	2019-04-08
KR20010012355A	2001-02-15

Attorney, Agent or Firm:

KIM, Hong Gyun (KR)

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