Title:
POLYESTER RESIN COMPOSITION FOR ELECTRICAL / ELECTRONIC PART-SEALING MATERIAL, SEALED PRODUCT AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2012/124435
Kind Code:
A1
Abstract:
Provided is a polyester resin composition for electrical / electronic part-sealing material having the melt fluidity, initial peel strength, and initial dielectric breakdown strength that are required of sealing materials for electrical and electronic parts while also having excellent heat resistance, resistance to thermal aging, and durability with respect to hot-cold cycling. A polyester resin composition for electrical / electronic part-sealing material comprising, as the main component, a copolymer polyester elastomer that contains 50 weight% to 70 weight% of aliphatic polycarbonate segments and 6 equivalents /106 g to 50 equivalents/106 g of terminal vinyl groups, and a sealed product using same.
Inventors:
SAKAI JUNKO (JP)
SHIGA KENJI (JP)
SHIGA KENJI (JP)
Application Number:
PCT/JP2012/054030
Publication Date:
September 20, 2012
Filing Date:
February 21, 2012
Export Citation:
Assignee:
TOYO BOSEKI (JP)
SAKAI JUNKO (JP)
SHIGA KENJI (JP)
SAKAI JUNKO (JP)
SHIGA KENJI (JP)
International Classes:
C09K3/10; C08G63/64; C08L67/00; B29C39/10; B29C45/14; B29L31/34; H01G4/224; H01L23/29; H01L23/31
Domestic Patent References:
| WO2008093574A1 | 2008-08-07 |
Foreign References:
| JP2008163226A | 2008-07-17 | |||
| JP2007191665A | 2007-08-02 | |||
| JP2007191664A | 2007-08-02 | |||
| JPH05295094A | 1993-11-09 | |||
| JPS544990A | 1979-01-16 | |||
| JP2000178351A | 2000-06-27 | |||
| JP2003192778A | 2003-07-09 | |||
| JP2001206939A | 2001-07-31 | |||
| JP2001240663A | 2001-09-04 | |||
| JP2007138139A | 2007-06-07 |
Other References:
See also references of EP 2687573A4
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Claims:
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