POLYETHYLENE RESIN COMPOSITION

Title:

POLYETHYLENE RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/1992/002581

Kind Code:

A1

Abstract:

A polyethylene resin composition comprising: at least one high-density polyethylene resin selected from (a) a high-density polyethylene resin (resin A) and (b) a modified high-density polyethylene resin (resin B) prepared by grafting a monomer including an unsaturated carboxylic acid and its derivatives onto the resin A; at least one linear low-density polyethylene resin selected from (c) a linear low-density polyethylene resin (resin C) and (d) a modified linear low-density polyethylene resin (resin D) prepared by grafting the monomer mentioned in the above item (b) onto the resin C; and (e) a linear ultralow-density polyethylene resin (resin E) with a density of 0.890 to less than 0.910 g/cm3 and a melting point of 110 to 125 °C. The composition provides a material which is excellent in fuel oil, low-temperature impact and heat resistances and has affinity for or adhesiveness to various synthetic resin and metal materials.

Inventors:

MATSUOKA MASAMI (JP)
AOYAGI HIKARU (JP)

Application Number:

PCT/JP1991/001062

Publication Date:

February 20, 1992

Filing Date:

August 08, 1991

Export Citation:

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Assignee:

SHOWA DENKO KK (JP)

International Classes:

C08L23/06; C08L23/08; C08L23/26; C08L51/00; C08L23/04; C08L51/06; (IPC1-7): B32B27/32; C08L23/04; C08L23/26; C08L51/06

Foreign References:

JPS62119248A	1987-05-30
JPS6114242A	1986-01-22
JPS60130636A	1985-07-12
JPS628461B2	1987-02-23

Other References: