Title:
POLYFUNCTIONAL VINYL RESIN, AND PRODUCTION METHOD, COMPOSITION, AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2024/071047
Kind Code:
A1
Abstract:
Provided is a vinyl resin that has excellent solubility against solvents, that provides a cured product having excellent heat resistance, thermal degradation stability, thermal conductivity, low permittivity, low dielectric loss tangent, and fire resistance, and that is useful for sealing electric/electronic components, and useful as circuit board materials and the like. This polyfunctional vinyl resin is represented by general formula (1) and is characterized by having a vinyl equivalent of 200-450 g/eq, a hydroxyl equivalent of 5000 g/eq or more, and a total chlorine amount of 1000 ppm or less.
Inventors:
OMURA MASAKI (JP)
OGAMI KOICHIRO (JP)
SHRESTHA NIRANJAN KUMAR (JP)
OGAMI KOICHIRO (JP)
SHRESTHA NIRANJAN KUMAR (JP)
Application Number:
PCT/JP2023/034756
Publication Date:
April 04, 2024
Filing Date:
September 25, 2023
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
C08G61/00; C08F299/02; C08G61/02
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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