Title:
POLYIMIDE FILM FOR DISPLAY SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/088441
Kind Code:
A1
Abstract:
The present invention provides a polyimide film comprising a polyimide, of which the Intf value calculated from equation 1 is -3 or greater when the weight reduction rate measured by the thermogravimetric method (TGA) is 5%. The film according to the present invention can exhibit excellent thermal stability even in high-temperature conditions, and thus maintain excellent heat resistance and mechanical characteristics against high-temperature heat added during the display device manufacturing process. [Equation 1] In equation 1, Ea, R, T, β, P(X f), and tf are the same as those defined in the detailed description.
Inventors:
LEE JINHO (KR)
Application Number:
PCT/KR2018/010603
Publication Date:
May 09, 2019
Filing Date:
September 11, 2018
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08J5/18; C08G73/10; C08L79/08; G02F1/1333
Foreign References:
| JP2012035583A | 2012-02-23 | |||
| KR20160067413A | 2016-06-14 | |||
| KR20160065806A | 2016-06-09 | |||
| JP2014237270A | 2014-12-18 | |||
| CN102089366A | 2011-06-08 | |||
| KR20140083233A | 2014-07-04 | |||
| KR20170145815A | 2017-11-03 |
Other References:
DEREK J. TOOP: "Theory of Life Testing and Use of Thermogravimetric Analysis to Predict the Thermal Life of Wire Enamens", IEEE TRANSACTIONS ON ELECTRICAL INSULATION, vol. EI-6, no. 1, March 1971 (1971-03-01)
See also references of EP 3556799A4
See also references of EP 3556799A4
Attorney, Agent or Firm:
KIM, Aera (KR)
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