Title:
POLYIMIDE FILM, FLEXIBLE METAL FOIL CLAD LAMINATE COMPRISING SAME AND METHOD FOR MANUFACTURING POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2020/218693
Kind Code:
A1
Abstract:
The present invention relates to a polyimide film having a low dielectric dissipation factor (Df), a flexible metal foil clad laminate comprising same and a method for manufacturing the polyimide film having a low Df. The polyimide film of the present invention is manufactured by imidizing a final polyamic acid comprising a first polyamic acid comprising a first block derived from pyromellitic dianhydride (PMDA) and m-tolidine, wherein the average molecular weight of the first block is 20,000 g/mol or less.
Inventors:
KIM KI-HOON (KR)
LEE KIL-NAM (KR)
CHOI JEONG-YEUL (KR)
BACK SUNG-YUL (KR)
CHO MIN-SANG (KR)
LEE KIL-NAM (KR)
CHOI JEONG-YEUL (KR)
BACK SUNG-YUL (KR)
CHO MIN-SANG (KR)
Application Number:
PCT/KR2019/013962
Publication Date:
October 29, 2020
Filing Date:
October 23, 2019
Export Citation:
Assignee:
PI ADVANCED MAT CO LTD (KR)
International Classes:
B32B15/08; C08G73/10; C08J5/18; C08L79/08
Foreign References:
| KR20130080433A | 2013-07-12 | |||
| KR20060067879A | 2006-06-20 | |||
| KR101906393B1 | 2018-10-11 | |||
| KR20170061348A | 2017-06-05 | |||
| KR101819769B1 | 2018-01-17 | |||
| US20160355652A1 | 2016-12-08 |
Attorney, Agent or Firm:
HANYANG PATENT FIRM (KR)
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