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Patent Searching and Data


Title:
POLYIMIDE FILM HAVING HIGH DIMENSIONAL STABILITY AND METHOD FOR PREPARING SAME
Document Type and Number:
WIPO Patent Application WO/2023/075542
Kind Code:
A1
Abstract:
Provided are a polyimide film having excellent dimensional stability and having a expansion coefficient ratio, represented by equation 1 below, of greater than 0 and less than or equal to 2.5, and a method for preparing same. The polyamide film is prepared by means of an imidization reaction of a polyamic acid solution containing two or more types of acid dianhydride components and two or more types of diamine components, thereby satisfying the the expansion coefficient ratio. Expansion coefficient ratio = hygroscopic expansion coefficient (ppm/RH%)/thermal expansion coefficient (ppm/℃)

Inventors:
KIM DONG-YOUNG (KR)
YOO DAE-GEON (KR)
WON DONG-YOUNG (KR)
Application Number:
PCT/KR2022/016808
Publication Date:
May 04, 2023
Filing Date:
October 31, 2022
Export Citation:
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Assignee:
PI ADVANCED MAT CO LTD (KR)
International Classes:
C08J5/18; B32B15/08; C08G73/10
Foreign References:
KR20110012753A2011-02-09
KR20000035259A2000-06-26
KR20210033364A2021-03-26
KR20190038383A2019-04-08
JP2014001392A2014-01-09
KR20220060476A2022-05-11
Attorney, Agent or Firm:
HANYANG PATENT FIRM (KR)
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