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Patent Searching and Data


Title:
POLYIMIDE FILM HAVING LOW DIELECTRIC AND HIGH HEAT RESISTANT PROPERTIES AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/211225
Kind Code:
A1
Abstract:
Provided is a polyimide film that is prepared by imidizing a polyamic acid solution containing two or more dianhydride components selected from the group consisting of biphenyltetracarboxylic dianhydride (BPDA), pyromellitic dianhydride (PMDA), and p-phenylenebis(trimellitate anhydride) (TAHQ), and at least one diamine component selected from oxydianiline (ODA), p-phenylenediamine (PPD), and m-tolidine (mTD), and that has a dielectric dissipation factor (Df) of 0.0025 or less and a glass transition temperature (Tg) of 240 ℃ or more.

Inventors:
JUNG YOUNG-JIN (KR)
WON DONG-YOUNG (KR)
BACK SUNG-YUL (KR)
CHO MIN-SANG (KR)
CHAE SU-KYUNG (KR)
Application Number:
PCT/KR2023/005813
Publication Date:
November 02, 2023
Filing Date:
April 27, 2023
Export Citation:
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Assignee:
PI ADVANCED MAT CO LTD (KR)
International Classes:
C08J5/18; B32B15/08; B32B27/28; C08G73/10
Domestic Patent References:
WO2021091012A12021-05-14
Foreign References:
KR20210057939A2021-05-24
KR20200044404A2020-04-29
KR20210055267A2021-05-17
KR20210055265A2021-05-17
Attorney, Agent or Firm:
HANYANG PATENT FIRM (KR)
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