Title:
POLYIMIDE FILM LAMINATE
Document Type and Number:
WIPO Patent Application WO/2006/112523
Kind Code:
A1
Abstract:
Disclosed is a polyimide film laminate composed of an aromatic polyimide layer and a metal layer. This polyimide film laminate is formed by spreading a polyamic acid solution composition over a metal foil and imidating the polyamic acid thereon. The polyamic acid solution composition contains 3,3',4,4'-biphenyltetracarboxylic acid dianhydride as an essential tetracarboxylic acid dianhydride component, while being added with a specific diamine component. This polyimide film laminate is excellent in gas permeation rate and water vapor permeation rate, while having heat resistance, high elastic modulus and low linear expansion coefficient. Further, foaming or separation is suppressed in a high-temperature step of the production process of this polyimide film laminate.
Inventors:
MURAKAMI MASATO (JP)
YAMAGUCHI HIROAKI (JP)
YAMAGUCHI HIROAKI (JP)
Application Number:
PCT/JP2006/308478
Publication Date:
October 26, 2006
Filing Date:
April 17, 2006
Export Citation:
Assignee:
UBE INDUSTRIES (JP)
MURAKAMI MASATO (JP)
YAMAGUCHI HIROAKI (JP)
MURAKAMI MASATO (JP)
YAMAGUCHI HIROAKI (JP)
International Classes:
B32B15/088; C08G73/10; H05K1/03
Foreign References:
| JPH08134212A | 1996-05-28 | |||
| JPH07307114A | 1995-11-21 | |||
| JPS61111181A | 1986-05-29 | |||
| JPH03145185A | 1991-06-20 | |||
| JP2005019770A | 2005-01-20 | |||
| JP2004230670A | 2004-08-19 | |||
| JP2003071982A | 2003-03-12 | |||
| JPS63288744A | 1988-11-25 |
Attorney, Agent or Firm:
Aoki, Atsushi (Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chom, Minato-ku Tokyo 23, JP)
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