POLYIMIDE FILM AND PROCESS FOR PRODUCING THE SAME

Title:

POLYIMIDE FILM AND PROCESS FOR PRODUCING THE SAME

Document Type and Number:

WIPO Patent Application WO/2004/031270

Kind Code:

A1

Abstract:

An oriented polyimide film which has a high Young's modulus, satisfactory resistance to moist heat, and low hygroscopicity. The polyimide film consists mainly of pyromellitic acid units and of 30 to 99 mol% p-phenylenediamine units and 1 to 70 mol% diamine units which are structural units represented by the following formula (II): (II) (wherein Ar^IIa and Ar^IIb each independently is a C_6-20 aromatic group optionally having an unreactive substituent; and X consists of at least one member selected among -O-, -O-Ar^IIc-O-, -SO₂-, and -O-Ar^IId-O-Ar^IIe-O-). It is characterized by having an in-plane Young's modulus of 3 GPa or higher in two perpendicular directions and having a moisture absorption as measured at 72% RH and 25°C of 3.3 wt.% or lower.

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Inventors:

ISHIWATA TOYOAKI (JP)
NAKAMURA TSUTOMU (JP)
KOJIMA KAZUNORI (JP)
SAWAKI TORU (JP)

Application Number:

PCT/JP2003/004085

Publication Date:

April 15, 2004

Filing Date:

March 31, 2003

Export Citation:

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Assignee:

TEIJIN LTD (JP)
ISHIWATA TOYOAKI (JP)
NAKAMURA TSUTOMU (JP)
KOJIMA KAZUNORI (JP)
SAWAKI TORU (JP)

International Classes:

B29D7/01; C08G73/10; C08J5/18; B29C41/00; H05K1/03; (IPC1-7): C08J5/18; B29C41/12; B29C55/12; B29C71/02; C08G73/10; H01L21/60; H01L23/50; H05K1/03

Domestic Patent References:

WO2002016475A2	2002-02-28
WO2001081456A1	2001-11-01

Foreign References:

JP2001081213A	2001-03-27
JP2000080165A	2000-03-21
JP2003109989A	2003-04-11
EP0276405A2	1988-08-03
JPH03264333A	1991-11-25
JP2000119418A	2000-04-25
EP1236756A1	2002-09-04
EP0710690A2	1996-05-08
US6350844B1	2002-02-26

Other References: