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Title:
POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2024/024570
Kind Code:
A1
Abstract:
The present invention relates to a polyimide film that comprises a polyimide resin, that has a tensile elastic modulus of greater than 7.6 GPa, that has a total light transmittance of 85% or more, and that has a yellowness of not more than 7.0.

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Inventors:
SHIMOYAMA TAKERU (JP)
SAKURAI TAKASHI (JP)
HOMYAK PATRICK (US)
ZOOMBELT ARJAN (US)
WU WEI-CHIH (US)
Application Number:
PCT/JP2023/026266
Publication Date:
February 01, 2024
Filing Date:
July 18, 2023
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
ZYMERGEN INC (US)
International Classes:
C08J5/18; C08G73/10; C08K7/02; C08L79/04
Domestic Patent References:
WO2021221118A12021-11-04
WO2016063993A12016-04-28
WO2023048121A12023-03-30
Foreign References:
JP2021533237A2021-12-02
JP6947323B12021-10-13
JP2023053917A2023-04-13
JP2015508772A2015-03-23
US20200385524A12020-12-10
JP2016210735A2016-12-15
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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