POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM, AND POLYIMIDE FILM/SUBSTRATE LAYERED-PRODUCT

WIPO Patent Application WO/2024/024901

A1

Disclosed is a polyimide precursor composition containing, in prescribed amounts, a polyimide precursor having a repeating unit represented by general formula (I), and at least one imidazole compound as an optional component. By using the same, it is possible to produce a polyimide film having improved optical transparency and adherence in a polyimide film/substrate layered-product, while making use of the advantages of an aromatic polyimide film such as heat resistance and linear thermal expansion coefficient. In the formula, X1 either (i) includes 50 mol% or more of a structure represented by formula (1-1) and includes 70 mol% or more of the total of the structure represented by formula (1-1) and a structure represented by formula (1-2), or (ii) includes 70 mol% or more of the total of the structure represented by formula (1-1) and/or the structure represented by formula (1-2), and Y1 includes 70 mol% or more of a structure represented by formula (B). However, in the case of (ii) described above, the imidazole compound is contained in an amount not less than 0.01 mol but less than 1 mol with respect to 1 mol of repeating units of the polyimide precursor.

OKA TAKUYA (JP)
NEMOTO YUKI (JP)
KOHAMA YUKINORI (JP)
ITO TAICHI (JP)

PCT/JP2023/027627

February 01, 2024

July 27, 2023

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UBE CORP (JP)

C08G73/10; B05D7/00; B05D7/24; B32B17/10; B32B27/34; C08K5/3445; C08L79/08; H05K1/03

WO2017051827A1

2017-03-30

JP2014029465A	2014-02-13
JP2018158535A	2018-10-11
JP2014173028A	2014-09-22
CN110003470A	2019-07-12
JP2021175790A	2021-11-04

ITO Katsuhiro (JP)

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