Title:
POLYIMIDE PRECURSOR COMPOSITION, AND POLYIMIDE PRODUCTION METHOD AND POLYIMIDE FILM USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/130437
Kind Code:
A1
Abstract:
The present invention relates to a polyimide precursor composition, a polyimide film production method using same, and a polyimide film using same.
Inventors:
LIM YOON BIN (KR)
LEE TAE SEOB (KR)
LIM JAE GU (KR)
LIM SEUNG JOON (KR)
KIM SE JEONG (KR)
KIM WOO HAN (KR)
PARK GIEUN (KR)
LEE TAE SEOB (KR)
LIM JAE GU (KR)
LIM SEUNG JOON (KR)
KIM SE JEONG (KR)
KIM WOO HAN (KR)
PARK GIEUN (KR)
Application Number:
PCT/KR2019/017169
Publication Date:
June 25, 2020
Filing Date:
December 06, 2019
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08G73/12; C08G73/10; C08J5/18
Foreign References:
| JP2018070829A | 2018-05-10 | |||
| KR20090028769A | 2009-03-19 | |||
| KR20130008386A | 2013-01-22 |
Other References:
KIM, J. W. ET AL.: "Synthesis and performance of polyimide films for the flexible organic light emitting diodes", MOLECULAR CRYSTALS AND LIQUID CRYSTALS, vol. 513, no. 1, 2009, pages 214 - 226, XP055721850
CHEN, C.-H. ET AL.: "High-tg, low-dielectric epoxy thermosets derived from methacrylate-containing polyimides", POLYMERS, vol. 10, no. 1, 2018, pages 1 - 15, XP055721852, [retrieved on 20171225]
CHEN, C.-H. ET AL.: "High-tg, low-dielectric epoxy thermosets derived from methacrylate-containing polyimides", POLYMERS, vol. 10, no. 1, 2018, pages 1 - 15, XP055721852, [retrieved on 20171225]
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (KR)
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