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Title:
POLYIMIDE PRECURSOR, POLYIMIDE, POLYIMIDE FILM, VARNISH, AND SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/046064
Kind Code:
A1
Abstract:
The invention pertains to a polyimide precursor containing at least one repeating unit represented by chemical formula (5) and/or at least one repeating unit represented by chemical formula (6). (In the formula, A3 is a bivalent group obtained by removing an amino group from an aromatic diamine or aliphatic diamine, and X3 and Y3 are each independently hydrogen, an alkyl group having 1-6 carbon atoms, or an alkylsilyl group having 3-9 carbon atoms.) (In the formula, A3 is a bivalent group obtained by removing an amino group from an aromatic diamine or aliphatic diamine, and X4 and Y4 are each independently hydrogen, an alkyl group having 1-6 carbon atoms, or an alkylsilyl group having 3-9 carbon atoms.)

Inventors:
OKA TAKUYA (JP)
KOHAMA YUKINORI (JP)
WATANABE YOSHIYUKI (JP)
HISANO NOBUHARU (JP)
Application Number:
PCT/JP2013/074943
Publication Date:
March 27, 2014
Filing Date:
September 13, 2013
Export Citation:
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Assignee:
UBE INDUSTRIES (JP)
International Classes:
C08G73/10
Domestic Patent References:
WO2011099518A12011-08-18
Foreign References:
JP2011162479A2011-08-25
JP2006349852A2006-12-28
Attorney, Agent or Firm:
ITO, Katsuhiro et al. (JP)
Katsuhiro Ito (JP)
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