Title:
POLYIMIDE PRECURSOR RESIN COMPOSITION WITH IMPROVED RESIN STABILITY AND HEAT RESISTANCE AND HAVING TRANSPARENCY, METHOD FOR PRODUCING POLYIMIDE FILM USING SAME, AND POLYIMIDE FILM PRODUCED THEREBY
Document Type and Number:
WIPO Patent Application WO/2018/038309
Kind Code:
A1
Abstract:
The present invention relates to a transparent polyamic acid precursor resin composition which does not cause a white cloudy phenomenon during solution casting while having excellent mechanical properties, high heat resistance and low thermal expansion coefficient by optimizing aromatic diamine and acid dianhydride for improving heat resistance and mechanical properties, and an organic solvent in which a white turbidity phenomenon does not occur; a method for producing a polyimide film using the same; and a polyimide film produced thereby.
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Inventors:
KANG JIN SOO (KR)
KIM JIN MO (KR)
AHN YONG HO (KR)
OH KYUNG OK (KR)
HAN SEUNG JIN (KR)
CHOI ENU GI (KR)
KIM JIN MO (KR)
AHN YONG HO (KR)
OH KYUNG OK (KR)
HAN SEUNG JIN (KR)
CHOI ENU GI (KR)
Application Number:
PCT/KR2016/010435
Publication Date:
March 01, 2018
Filing Date:
September 20, 2016
Export Citation:
Assignee:
DAELIM CORP CO LTD (KR)
International Classes:
C08J5/18; C08G73/10; C08L79/08
Foreign References:
| KR20160079836A | 2016-07-06 | |||
| JP2015218179A | 2015-12-07 | |||
| KR20160059097A | 2016-05-26 | |||
| KR20160030889A | 2016-03-21 | |||
| KR20120113376A | 2012-10-15 |
Attorney, Agent or Firm:
HALLA PATENT & LAW FIRM (KR)
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