Title:
POLYIMIDE PRECURSOR AND POLYIMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/241523
Kind Code:
A1
Abstract:
A resin composition which contains: a polyimide precursor or polyimide having a structural unit represented by a specific general formula; and a compound represented by general formula (3). The total amount of compounds represented by general formula (3) where n is 4 is more than 0 ppm but not more than 70 ppm based on the mass of the resin composition; or the total amount of compounds represented by general formula (3) where n is 5 is more than 0 ppm but not more than 30 ppm based on the mass of the resin composition.
Inventors:
KASHIWADA TAKESHI (JP)
SHINOHARA NAOYUKI (JP)
OKUDA TOSHIAKI (JP)
KANADA TAKAYUKI (JP)
SHINOHARA NAOYUKI (JP)
OKUDA TOSHIAKI (JP)
KANADA TAKAYUKI (JP)
Application Number:
PCT/JP2020/020402
Publication Date:
December 03, 2020
Filing Date:
May 22, 2020
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
B32B27/34; C08G73/10; C08J5/18; C08K5/5419; C08L79/08
Domestic Patent References:
| WO2010067485A1 | 2010-06-17 | |||
| WO2014098235A1 | 2014-06-26 |
Foreign References:
| JP2016029126A | 2016-03-03 | |||
| JPH09272739A | 1997-10-21 | |||
| JPH11217390A | 1999-08-10 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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