Title:
POLYIMIDE PRECURSOR
Document Type and Number:
WIPO Patent Application WO/2023/200151
Kind Code:
A1
Abstract:
The present application provides: a polyimide precursor capable of achieving all of a low dielectric constant, light resistance, heat resistance, insulating properties, and mechanical properties under severe conditions such as high temperatures, by comprising a high-molecular-weight polyamic acid; a method for preparing the polyamic acid; a method for increasing the molecular weight of the polyamic acid; a film comprising the precursor; and a display device having a substrate to which the film is attached.
Inventors:
PARK SE JOO (KR)
WE JUNG HOON (KR)
PARK JOON CHUL (KR)
LEE IK SANG (KR)
WE JUNG HOON (KR)
PARK JOON CHUL (KR)
LEE IK SANG (KR)
Application Number:
PCT/KR2023/004166
Publication Date:
October 19, 2023
Filing Date:
March 29, 2023
Export Citation:
Assignee:
PI ADVANCED MAT CO LTD (KR)
International Classes:
C08G73/10; C08J5/18
Foreign References:
| KR20190038268A | 2019-04-08 | |||
| KR20220007951A | 2022-01-20 | |||
| KR20220031281A | 2022-03-11 | |||
| KR20180012196A | 2018-02-05 | |||
| KR20190059819A | 2019-05-31 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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