Title:
POLYIMIDE PRECURSOR
Document Type and Number:
WIPO Patent Application WO/2023/200156
Kind Code:
A1
Abstract:
The present application provides: a polyimide precursor capable of implementing a polyimide with environmentally friendly high adhesion and excellent surface flatness and durability; a method for preparing the polyimide precursor; and a polyimide film comprising a cured product of the polyimide precursor.
Inventors:
PARK SE JOO (KR)
WE JUNG HOON (KR)
PARK JOON CHUL (KR)
LEE IK SANG (KR)
WE JUNG HOON (KR)
PARK JOON CHUL (KR)
LEE IK SANG (KR)
Application Number:
PCT/KR2023/004311
Publication Date:
October 19, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
PI ADVANCED MAT CO LTD (KR)
International Classes:
C08G73/10; C08J5/18; C08K5/50; C08K5/521; C08L79/08
Foreign References:
| KR20180012196A | 2018-02-05 | |||
| CN105368048A | 2016-03-02 | |||
| KR20190003328A | 2019-01-09 | |||
| KR101992576B1 | 2019-06-24 | |||
| KR20170016384A | 2017-02-13 | |||
| KR102013534B1 | 2019-08-22 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
Download PDF: