Title:
POLYIMIDE RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/105969
Kind Code:
A1
Abstract:
The present invention provides: a polyimide resin composition which comprises a polyimide resin (A) that contains a repeating constituent unit represented by formula (1) and a repeating constituent unit represented by formula (2), with the content ratio of the repeating constituent unit represented by formula (1) to the total amount of the repeating constituent unit represented by formula (1) and the repeating constituent unit represented by formula (2) being 20-70 mol%, and an amorphous resin (B) that contains a repeating constituent unit represented by formula (I); and a molded body which comprises this polyimide resin composition. (In the formulae, R1 is a C6-C22 divalent group which comprises at least one alicyclic hydrocarbon structure; R2 is a C5-C16 divalent chain aliphatic group; and X1 and X2 are each independently a C6-C22 tetravalent group which comprises at least one aromatic ring.)
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Inventors:
SAKAI ATSUSHI (JP)
SATO YUUKI (JP)
FUKUSHIMA TAKUYA (JP)
SATO YUUKI (JP)
FUKUSHIMA TAKUYA (JP)
Application Number:
PCT/JP2022/039908
Publication Date:
June 15, 2023
Filing Date:
October 26, 2022
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L79/08; C08G73/10
Domestic Patent References:
| WO2021131501A1 | 2021-07-01 | |||
| WO2019220969A1 | 2019-11-21 | |||
| WO2016147996A1 | 2016-09-22 |
Foreign References:
| JP2018070699A | 2018-05-10 | |||
| JP2021122990A | 2021-08-30 | |||
| JP2022045273A | 2022-03-18 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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