Title:
POLYIMIDE RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/166971
Kind Code:
A1
Abstract:
A polyimide resin composition that contains polyimide resin (A) having a specific structure and compound (B) represented by formula (5). (R51 is an alkyl group having 1-10 carbon atoms or an alkoxy group having 1-10 carbon atoms. R52 to R53 and R61 to R66 are independently an alkyl group having 1-4 carbon atoms or an alkoxy group having 1-4 carbon atoms. p51 is an integer of 0-6, p52 and p53 are independently an integer of 0-4, and p63 and p66 are independently an integer of 0-3. When p51 to p53, p63 or p66 are 2 or more, the multiple R51s to R53s, R63s or R66s may be either the same as or different from each other. n is an integer of 1-10.)
Inventors:
FUJII RYOSUKE (JP)
SAKAI ATSUSHI (JP)
SATO YUUKI (JP)
SAKAI ATSUSHI (JP)
SATO YUUKI (JP)
Application Number:
PCT/JP2023/004918
Publication Date:
September 07, 2023
Filing Date:
February 14, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L79/08; B32B15/088; B32B27/18; C08G73/10; C08K5/52
Domestic Patent References:
| WO2015020020A1 | 2015-02-12 | |||
| WO2020031495A1 | 2020-02-13 | |||
| WO2019220968A1 | 2019-11-21 |
Foreign References:
| JP2020200419A | 2020-12-17 | |||
| JP2020189944A | 2020-11-26 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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