POLYIMIDE RESIN, MANUFACTURING METHOD THEREFOR, ADHESIVE RESIN COMPOSITION, COVERLAY FILM, AND CIRCUIT BOARD

Title:

POLYIMIDE RESIN, MANUFACTURING METHOD THEREFOR, ADHESIVE RESIN COMPOSITION, COVERLAY FILM, AND CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2011/077917

Kind Code:

A1

Abstract:

Provided is a polyimide resin obtained by reacting an amino compound, said amino compound having at least two primary amino groups as functional groups, with a ketone group in a polyimide-siloxane that has constituent units represented by general formulas (1) and (2). In said formulas, Ar represents a tetravalent aromatic group derived from an aromatic tetracarboxylic acid anhydride; R1 represents a divalent diaminosiloxane residue derived from a diaminosiloxane; R2 represents a divalent aromatic diamine residue derived from an aromatic diamine; Ar and/or R2 contains a ketone group; m and n represent the molar ratio between the constituent units; m is between 0.75 and 1; and n is between 0 and 0.25.

Inventors:

MORI AKIRA (JP)
SUTO YOSHIKI (JP)
NAKAMURA KOJI (JP)

Application Number:

PCT/JP2010/071538

Publication Date:

June 30, 2011

Filing Date:

December 02, 2010

Export Citation:

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Assignee:

NIPPON STEEL CHEMICAL CO (JP)
MORI AKIRA (JP)
SUTO YOSHIKI (JP)
NAKAMURA KOJI (JP)

International Classes:

C08G73/10; C08K5/18; C08L79/08; C09J7/02; C09J179/08; H05K1/03; H05K3/28; B32B27/34

Domestic Patent References:

WO2007052540A1

2007-05-10

Foreign References:

JP2009029982A	2009-02-12
JP2008291063A	2008-12-04
JP2006104447A	2006-04-20