Title:
POLYIMIDE RESIN AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2020/137871
Kind Code:
A1
Abstract:
The present invention provides: a polyimide resin which is capable of forming a film that has excellent bending resistance; and a method for producing this polyimide resin. This polyimide resin has a weight average molecular weight of 150,000 or more and a molecular weight distribution (Mw/Mn) of 3.0 or less, said molecular weight distribution (Mw/Mn) being a ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn). In addition, this polyimide resin is able to be obtained by a production method which comprises a step (I) for obtaining an intermediate (K), said step (I) comprising a step (A) wherein a diamine compound and a carboxylic acid compound having three or more carbonyl groups are reacted with each other, and a step (II) for decomposing the intermediate (K), and which is configured such that the step (II) comprises a part where formula (1) is satisfied.
(1): dv/dt < 0
Inventors:
NISHIYAMA NATSUMI (JP)
GOSHIMA KAZUYUKI (JP)
MIYAMOTO KOJI (JP)
YOSHIKAWA GAKU (JP)
GOSHIMA KAZUYUKI (JP)
MIYAMOTO KOJI (JP)
YOSHIKAWA GAKU (JP)
Application Number:
PCT/JP2019/050060
Publication Date:
July 02, 2020
Filing Date:
December 20, 2019
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08G73/10
Foreign References:
| JPH11228694A | 1999-08-24 | |||
| JPH0770277A | 1995-03-14 | |||
| JPH0770276A | 1995-03-14 | |||
| JPH0859832A | 1996-03-05 | |||
| JPS57212230A | 1982-12-27 | |||
| JPS4714714B1 | 1972-05-02 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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