Title:
POLYIMIDE RESIN MOLDED BODY AND PRODUCTION METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2021/246532
Kind Code:
A1
Abstract:
The present invention relates to: a thick molded body that comprises an addition reaction–type polyimide resin, has no surface defects, such as voids or fissures, and no internal voids, and is at least 5 mm thick; and a production method for the molded body. A resin molded body that comprises an addition reaction–type polyimide resin and is formed by holding a prepolymer of an addition reaction–type polyimide resin at at least a thickening start temperature for the addition reaction–type polyimide resin, increasing the melt viscosity to 70–900 kPa·s at a temperature that is 10°C below the thickening start temperature, grinding and mixing to obtain a molding precursor, and shaping the molding precursor at at least a thermosetting temperature for the addition reaction–type polyimide resin. The resin molded body is characterized by having a thickness of at least 5 mm and in that the number of defects that are at least 0.5 mm is no more than 1/100 cm2 over the entire surface of the molded body.
Inventors:
SEGAMI KOUTA (JP)
WATANABE KAZUNOBU (JP)
KOBAYASHI YUSUKE (JP)
WATANABE KAZUNOBU (JP)
KOBAYASHI YUSUKE (JP)
Application Number:
PCT/JP2021/021473
Publication Date:
December 09, 2021
Filing Date:
June 07, 2021
Export Citation:
Assignee:
TOYO SEIKAN GROUP HOLDINGS LTD (JP)
International Classes:
B29C43/34; C08F299/02; C08J5/00; B29K79/00; B29L7/00; C08J3/12
Domestic Patent References:
| WO2016039485A1 | 2016-03-17 | |||
| WO2018190370A1 | 2018-10-18 | |||
| WO2019107352A1 | 2019-06-06 | |||
| WO2011055530A1 | 2011-05-12 |
Foreign References:
| JP2009274284A | 2009-11-26 | |||
| JP2008119974A | 2008-05-29 | |||
| JP2003526704A | 2003-09-09 |
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
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