Title:
POLYIMIDE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/140845
Kind Code:
A1
Abstract:
A modified polyimide resin including a structure represented by general formula (I). A polyimide resin including a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine compound, wherein the structural unit A includes, at a ratio of 60 mol% or more, a structural unit derived from a compound having a specific structure.
Inventors:
MIYAHARA DAICHI (JP)
SATO YUMI (JP)
SATO YUMI (JP)
Application Number:
PCT/JP2020/046718
Publication Date:
July 15, 2021
Filing Date:
December 15, 2020
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10; C08L79/08; G03F7/027
Domestic Patent References:
| WO2017030019A1 | 2017-02-23 | |||
| WO2015163314A1 | 2015-10-29 | |||
| WO2017030019A1 | 2017-02-23 | |||
| WO2015163314A1 | 2015-10-29 |
Foreign References:
| JP2014024894A | 2014-02-06 | |||
| JP2000147768A | 2000-05-26 | |||
| JP2007108761A | 2007-04-26 | |||
| JP2006146244A | 2006-06-08 | |||
| CN102807675A | 2012-12-05 | |||
| JP2003168800A | 2003-06-13 | |||
| JP2005015629A | 2005-01-20 | |||
| JP2015134842A | 2015-07-27 | |||
| CN102807675A | 2012-12-05 |
Other References:
See also references of EP 4089135A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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