Title:
POLYIMIDE RESIN PRECURSOR
Document Type and Number:
WIPO Patent Application WO/2023/176172
Kind Code:
A1
Abstract:
Provided are: a polyimide resin precursor that yields a polyimide resin having a low dielectric loss tangent and excelling in a chemical resistance property; a production method for the polyimide resin precursor; a photosensitive resin composition including the polyimide resin precursor as a polymerizable resin (A); and a patterned resin film using the photosensitive resin composition, and a production method for the patterned polyimide resin film. A polymer of a diamine compound and a dicarboxylic acid which is a reactant with a tetracarboxylic dianhydride and an alcohol is used as the polyimide resin precursor, and a compound that either has a combination of a secondary hydroxyl group and an ethylenically unsaturated double bond, or has a combination of a methylol group and an ethylenically unsaturated double bond, is used as the aforementioned alcohol.
Inventors:
EBISAWA KAZUAKI (JP)
Application Number:
PCT/JP2023/002856
Publication Date:
September 21, 2023
Filing Date:
January 30, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C08G73/10; C08F299/02; G03F7/004; G03F7/027; G03F7/20
Foreign References:
| JP2018165819A | 2018-10-25 | |||
| JP2008015060A | 2008-01-24 | |||
| JPH0680776A | 1994-03-22 | |||
| JPH0822124A | 1996-01-23 | |||
| JPS61132544A | 1986-06-20 | |||
| JPH06214390A | 1994-08-05 | |||
| JP2001330950A | 2001-11-30 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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