Title:
POLYIMIDE RESIN AND PRODUCTION METHOD THEREFOR, POLYIMIDE SOLUTION, AND POLYIMIDE FILM AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/073972
Kind Code:
A1
Abstract:
This polyimide includes an alicyclic acid dianhydride, a fluorine-containing aromatic acid dianhydride, and a 3', 4, 4'-biphenyltetracarboxylic acid dianhydride, as acid dianhydrides, and a 3, 3'-diaminodiphenyl sulfone and a fluoroalkyl-substituted benzidine, as diamines. This polyimide film includes the abovementioned polyimide resin. The polyimide film can be obtained by applying, on a substrate, a polyimide solution obtained by dissolving the polyimide resin in an organic solvent, and removing the solvent.
Inventors:
KONDO YASUTAKA (JP)
Application Number:
PCT/JP2018/037607
Publication Date:
April 18, 2019
Filing Date:
October 09, 2018
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
| WO2017071643A1 | 2017-05-04 | |||
| WO2009107429A1 | 2009-09-03 | |||
| WO2017111299A1 | 2017-06-29 | |||
| WO2015122032A1 | 2015-08-20 | |||
| WO2015002273A1 | 2015-01-08 |
Foreign References:
| KR20140118386A | 2014-10-08 |
Attorney, Agent or Firm:
SHINTAKU, Masato et al. (JP)
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