Title:
POLYIMIDE RESIN, POLYIMIDE THIN FILM AND PREPARATION METHOD THEREFOR, AND FLEXIBLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/098424
Kind Code:
A1
Abstract:
The present application provides a polyimide resin, which is prepared by first complexing an aromatic diamine with crown ether and then copolymerizing same with an alicyclic dianhydride and an aromatic dianhydride, wherein the aromatic diamine comprises an aromatic diamine containing an amide bond. The Young's modulus of the polyimide resin is greater than or equal to 8 GPa, the elongation at break thereof is greater than or equal to 15%, and the tensile strength thereof is greater than or equal to 200 MPa. The present application further provides a thin film comprising the polyimide resin, a preparation method for the polyimide resin thin film, and a flexible device containing the thin film. In the polyimide resin of the present application, the crown ether is added to the main chain of the polyimide in a self-assembly manner, so that the mechanical strength of the polyimide resin is improved, and the polyimide resin has a high modulus, a high elongation at break, a high tensile strength, low haze and high transparency.
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Inventors:
LU QINGHUA (CN)
XIA XUEJIAN (CN)
QIN YUAN (CN)
SUN NANJIAN (CN)
HONG KIIL (CN)
MA RONG (CN)
LYU WANGCHUN (CN)
XIA XUEJIAN (CN)
QIN YUAN (CN)
SUN NANJIAN (CN)
HONG KIIL (CN)
MA RONG (CN)
LYU WANGCHUN (CN)
Application Number:
PCT/CN2022/130717
Publication Date:
June 08, 2023
Filing Date:
November 08, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
UNIV TONGJI (CN)
UNIV TONGJI (CN)
International Classes:
C08L79/00; C08G73/00
Foreign References:
| CN110643374A | 2020-01-03 | |||
| JP2012012493A | 2012-01-19 | |||
| CN104356647A | 2015-02-18 | |||
| CN112877079A | 2021-06-01 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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