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Patent Searching and Data


Title:
POLYIMIDE RESIN, POLYIMIDE VARNISH, POLYIMIDE FILM, AND TEMPORARY FIXING MATERIAL COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/058061
Kind Code:
A1
Abstract:
A polyimide resin having a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine, wherein the structural unit A includes a structural unit (A1) derived from a compound represented by formula (a1), and the structural unit B includes a structural unit (B1) derived from a compound represented by formula (b1) and a structural unit (B2) derived from a compound represented by formula (b2) (Z is a diphenylfluorene structure or a hexafluoro diphenylpropane structure, and X1 and X2 each represent -O-, -C(CH3)2-, or -C(CF3)2-.).

Inventors:
ABIKO YOHEI (JP)
YASUFUKU HARUKA (JP)
YONEHAMA SHINICHI (JP)
Application Number:
PCT/JP2023/032770
Publication Date:
March 21, 2024
Filing Date:
September 08, 2023
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10; C08J5/18; C09D179/08; C09J179/08; H01L21/304
Domestic Patent References:
WO2014103637A12014-07-03
Foreign References:
CN110894294A2020-03-20
JP2015093966A2015-05-18
JPH11292968A1999-10-26
CN101289537A2008-10-22
JP2003231753A2003-08-19
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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