Title:
POLYIMIDE RESIN, POLYIMIDE VARNISH AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2020/110947
Kind Code:
A1
Abstract:
Provided is a polyimide resin having constituent units A derived from tetracarboxylic dianhydride and constituent units B derived from diamine. The constituent units A include constituent units (A-1) derived from a compound represented by formula (a-1), and constituent units (A-2) derived from a compound represented by formula (a-2). Constituent units B include constituent units (B-1) derived from a compound represented by formula (b-1), and the ratio of constituent units (B-1) in constituent unit B is at least 70 mol%. Also provided are a polyimide varnish and a polyimide film containing said polyimide resin.
Inventors:
ABIKO YOHEI (JP)
HOSHINO SHUN (JP)
MURAYA TAKAHIRO (JP)
SEKIGUCHI SHINJI (JP)
TAKADA TAKAFUMI (JP)
HOSHINO SHUN (JP)
MURAYA TAKAHIRO (JP)
SEKIGUCHI SHINJI (JP)
TAKADA TAKAFUMI (JP)
Application Number:
PCT/JP2019/045814
Publication Date:
June 04, 2020
Filing Date:
November 22, 2019
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10
Domestic Patent References:
| WO2016158825A1 | 2016-10-06 | |||
| WO2017073782A1 | 2017-05-04 | |||
| WO2001040851A1 | 2001-06-07 |
Foreign References:
| JP2012167169A | 2012-09-06 |
Attorney, Agent or Firm:
HIRASAWA, Kenichi (JP)
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