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Title:
POLYIMIDE RESIN, POLYIMIDE VARNISH, AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2021/153379
Kind Code:
A1
Abstract:
A polyimide resin including a structural unit A derived from a tetracarboxylic acid dianhydride and a structural unit B derived from a diamine, wherein structural unit A includes a structural unit (A1) derived from a compound represented by formula (a1) and structural unit B includes a structural unit (B1) derived from a compound represented by formula (b1).

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Inventors:
ABIKO YOHEI (JP)
MITADERA JUN (JP)
Application Number:
PCT/JP2021/001883
Publication Date:
August 05, 2021
Filing Date:
January 20, 2021
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
WO2017191822A12017-11-09
WO2018066522A12018-04-12
Foreign References:
JP2019112632A2019-07-11
JP2015108092A2015-06-11
JP2018066017A2018-04-26
CN110396194A2019-11-01
CN105461923A2016-04-06
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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