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Patent Searching and Data


Title:
POLYIMIDE RESIN, POLYIMIDE VARNISH, AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2021/230199
Kind Code:
A1
Abstract:
A polyimide resin comprising constituent units A, which are derived from tetracarboxylic dianhydrides, and constituent unit B, which is derived from a diamine, wherein the constituent units A comprise constituent unit (A1), which is derived from 2,2',3,3',5,5'-hexamethyl[1,1'-biphenyl]-4,4'-diyl bis(1,3-dioxo-1,3-dihydro-2-benzofuran-5-carboxylate) and constituent unit (A2), which is derived from 1,2,4,5-cyclohexanetetracarboxlic dianhydride.

Inventors:
WAKITA NATSUMI (JP)
KOYAMA MASAYA (JP)
ABIKO YOHEI (JP)
HIROSE SHIGEYUKI (JP)
Application Number:
PCT/JP2021/017695
Publication Date:
November 18, 2021
Filing Date:
May 10, 2021
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/16; C08J5/18
Domestic Patent References:
WO2014046180A12014-03-27
WO2019211972A12019-11-07
Foreign References:
JP2009286706A2009-12-10
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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