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Title:
POLYIMIDE RESIN, POLYIMIDE VARNISH, AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2022/019226
Kind Code:
A1
Abstract:
A polyimide resin that has structural units A derived from tetracarboxylic acid dianhydride and structural units B derived from diamine, said structural units A containing structural units (A1) derived from 9,9-bis(3,4-dicarboxyphenyl)fluorene acid dianhydride and structural units (A2) derived from aliphatic tetracarboxylic acid dianhydride, and said structural units B containing structural units (B1) derived from 2,2'-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane.

Inventors:
WAKITA NATSUMI (JP)
HIROSE SHIGEYUKI (JP)
Application Number:
PCT/JP2021/026768
Publication Date:
January 27, 2022
Filing Date:
July 16, 2021
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10
Domestic Patent References:
WO2020110948A12020-06-04
Foreign References:
JP2013069505A2013-04-18
JP2020193325A2020-12-03
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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