Title:
POLYMER COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2016/103778
Kind Code:
A1
Abstract:
The present invention is a polymer composition which contains 5-100 parts by weight of (B) a glass filler and 5-20 parts by weight of (C) a metal oxide per 100 parts by weight of (A) a hydrogenated product of a crystalline cyclic olefin ring-opening polymer, which has a repeating unit derived from a polycyclic norbornene monomer having a tricyclic or higher cyclic ring. The present invention provides a polymer composition which is suitable for the formation of a plating by a Laser-Direct-Structuring method, and which is capable of providing a substrate that has excellent electrical insulation characteristics and high strength, while exhibiting excellent adhesion with a plating even in a high-temperature high-humidity environment.
Inventors:
KATO MASATSUGU (JP)
MIYAZAWA SHINSUKE (JP)
MIYAZAWA SHINSUKE (JP)
Application Number:
PCT/JP2015/071657
Publication Date:
June 30, 2016
Filing Date:
July 30, 2015
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08L65/00; C08K3/22; C08K3/34; C08K3/40
Domestic Patent References:
| WO2012033076A1 | 2012-03-15 |
Foreign References:
| JP2013256596A | 2013-12-26 | |||
| JP2014065756A | 2014-04-17 |
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
Haruhito Oishi (JP)
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