POLYMER COMPOUND, COMPOSITION FOR MOLDING, FILM AND CAPACITOR

Title:

POLYMER COMPOUND, COMPOSITION FOR MOLDING, FILM AND CAPACITOR

Document Type and Number:

WIPO Patent Application WO/2023/248874

Kind Code:

A1

Abstract:

The present disclosure addresses the problem of providing a novel polymer compound which has a higher dielectric constant than ever before. A polymer compound according to the present disclosure has a repeating unit (U) which comprises a diazabenzene ring, a substituent that is directly bonded to the diazabenzene ring, and a carbonyl group. The substituent comprises at least one atom or group that is selected from the group consisting of a hydrogen atom, a halogen atom, a hydroxy group, a formyl group, a carboxy group, an alkyl group having 1 to 6 carbon atoms, a haloalkyl group having 1 to 6 carbon atoms, and a hydroxyalkyl group having 1 to 6 carbon atoms.

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Inventors:

OGIHARA YUSUKE
HATTORI TAKAYUKI
NAKAMURA TATSUYA

Application Number:

PCT/JP2023/021923

Publication Date:

December 28, 2023

Filing Date:

June 13, 2023

Export Citation:

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Assignee:

PANASONIC IP MAN CO LTD (JP)

International Classes:

C08G6/00; C08G63/685; C08G67/00; C08J5/18; H01G4/32

Domestic Patent References:

WO2021095640A1	2021-05-20
WO2022023258A1	2022-02-03

Foreign References:

CN114621421A	2022-06-14
JPH09124777A	1997-05-13
US5459266A	1995-10-17