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Patent Searching and Data


Title:
POLYMER COMPOUND, AND RESIN COMPOSITION CONTAINING SAID COMPOUND
Document Type and Number:
WIPO Patent Application WO/2022/009744
Kind Code:
A1
Abstract:
This polymer compound is represented by formula (1) (in the formula, R1 and R2 each independently denote a hydrogen atom or a methyl group. m and n are average numbers of repeating units, and each independently denote a real number within the range of 1 to 2000). The polymer compound has sufficient flexibility to be able to form a film, exhibits high adhesion to a low roughness copper foil, and has a low dielectric constant and dielectric loss tangent.

Inventors:
AKATUKA YASUMASA (JP)
HAYASHIMOTO SHIGEO (JP)
Application Number:
PCT/JP2021/024697
Publication Date:
January 13, 2022
Filing Date:
June 30, 2021
Export Citation:
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Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F8/14; C08F212/08; C08K5/14; C08K5/3415; C08L25/14; C09J4/00; C09J7/00; C09J7/35
Foreign References:
JPH04198385A1992-07-17
JP2017171744A2017-09-28
Other References:
AZUMA, CHIAKI ET AL.: "Photo-polymerization and- copolymerization of Aromatic Diacrylates", POLYMER JOURNAL, vol. 4, no. 6, 1973, pages 628 - 636, XP055898152
T. NARASIMHASWAMY ET AL.: "Synthesis and Characterization of Phenyl Acrylates Gross-Linked to hydroquinone Diacrylate", MACROMOLECULES, vol. 25, 1992, pages 3338 - 3344
Attorney, Agent or Firm:
KAMIMURA Yoichiro (JP)
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