Title:
POLYMER AND CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/053988
Kind Code:
A1
Abstract:
According to the present invention, a polysilsesquioxane polymer (A) comprises: (a1) an alkoxysilyl group and/or (a2) a silanol group, which is bonded to a polysilsesquioxane skeleton; (b1) an alkyl group having 1 to 10 carbon atoms and/or (b2) an aryl group having 6 to 10 carbon atoms, which is directly bonded to a silicon atom in the skeleton; and (c1) a polyalkylene oxide polymer chain and/or (c2) a linear poly(meth)acrylic polymer chain. One end of the polyalkylene oxide polymer chain (c1) and/or the linear poly(meth)acrylic polymer chain (c2) is bonded to the polysilsesquioxane skeleton.
Inventors:
SAITO TAKAHIRO
Application Number:
PCT/JP2022/034565
Publication Date:
April 06, 2023
Filing Date:
September 15, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08G77/46; C08G77/442; C08L83/12; C09J183/12
Domestic Patent References:
| WO2004069923A1 | 2004-08-19 |
Foreign References:
| JPH11255889A | 1999-09-21 | |||
| JP2014047335A | 2014-03-17 | |||
| JP2011515514A | 2011-05-19 | |||
| JP2008525824A | 2008-07-17 | |||
| JP2013095814A | 2013-05-20 | |||
| JP2012066536A | 2012-04-05 | |||
| JP2005509042A | 2005-04-07 | |||
| KR20200122255A | 2020-10-27 |
Attorney, Agent or Firm:
ARCO PATENT & TRADEMARK ATTORNEYS (JP)
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